Performance of SAC305 and SAC305-0.4La lead free electronic solders at high temperature

Engineering & Materials Science

• Tin 94%
• Soldering alloys 79%
• Silver 78%
• Lanthanum 64%
• Copper 58%
• Thermal aging 44%
• Strain rate 33%
• Temperature 32%
• Microhardness 26%
• Yield stress 24%
• Microstructure 24%
• Tensile strength 21%
• Hardness 14%
• Doping (additives) 10%
• Microelectronics 9%
• Intermetallics 9%
• Tensile properties 9%
• Toughness 8%
• Lead 8%
• Packaging 8%
• Ductility 7%
• Materials properties 7%
• Aging of materials 7%
• Scanning electron microscopy 7%
• Fatigue of materials 6%
• Mechanical properties 5%

Physics & Astronomy

• solders 90%
• tin 75%
• silver 59%
• copper 51%
• lanthanum 48%
• electronics 42%
• performance 35%
• strain rate 31%
• yield strength 28%
• tensile strength 25%
• microhardness 25%
• microstructure 21%
• tensile tests 18%
• hardness 14%
• trends 13%
• supplements 10%
• tensile properties 10%
• toughness 9%
• test equipment 9%
• packaging 9%
• microelectronics 9%
• ductility 8%
• intermetallics 8%
• examination 7%
• methodology 7%
• mechanical properties 6%
• scanning electron microscopy 5%

Chemistry

• Solder 100%
• Thermal Aging 86%
• Strain 56%
• Yield Point 55%
• Microhardness 52%
• Microstructure 43%
• Tensile Strength 41%
• Brinell Hardness 27%
• Time 23%
• Ductility 19%
• Microelectronics 18%
• Intermetallic Compound 17%
• Error 12%
• Alloy 11%
• Scanning Electron Microscopy 9%