TY - GEN
T1 - Thin-film flexural ultrasonic transducers for air-coupled measurement
AU - Adams, Sam
AU - McKinlay, Michael
AU - Nunez, Carlos Garcia
AU - Kang, Lei
AU - Dixon, Steve
AU - Gibson, Des
AU - Feeney, Andrew
N1 - Publisher Copyright:
© 2025 IEEE.
PY - 2025/10/20
Y1 - 2025/10/20
N2 - The flexural ultrasonic transducer (FUT) is composed of a circular metallic plate bonded to a piezoelectric ceramic disc and attached to a cylindrical support. The ceramic's vibrations stimulate resonant modes in the plate, generating ultrasound waves in the medium in front. FUTs are utilised for proximity measurement, but with an increasing focus on using lead-free piezoceramic elements. Also, it is challenging to accurately distribute epoxy resin between the ceramic and the plate. Through thin films, the epoxy bond layer can be removed, allowing for FUT geometry to be readily controlled, with the potential for thicker films for transmitter and thinner films for receiver FUTs, enabling tailored responses. This will enable high-frequency FUTs, above 60 kHz, at which commercial FUTs struggle to operate efficiently.
AB - The flexural ultrasonic transducer (FUT) is composed of a circular metallic plate bonded to a piezoelectric ceramic disc and attached to a cylindrical support. The ceramic's vibrations stimulate resonant modes in the plate, generating ultrasound waves in the medium in front. FUTs are utilised for proximity measurement, but with an increasing focus on using lead-free piezoceramic elements. Also, it is challenging to accurately distribute epoxy resin between the ceramic and the plate. Through thin films, the epoxy bond layer can be removed, allowing for FUT geometry to be readily controlled, with the potential for thicker films for transmitter and thinner films for receiver FUTs, enabling tailored responses. This will enable high-frequency FUTs, above 60 kHz, at which commercial FUTs struggle to operate efficiently.
KW - epoxy bond layer
KW - FUT
KW - high frequency
KW - piezoceramic elements
KW - thin films
UR - https://www.scopus.com/pages/publications/105021810346
UR - https://2025.ieee-ius.org/
U2 - 10.1109/IUS62464.2025.11201545
DO - 10.1109/IUS62464.2025.11201545
M3 - Conference contribution
AN - SCOPUS:105021810346
SN - 9798331523336
T3 - IEEE International Ultrasonics Symposium, IUS
BT - 2025 IEEE International Ultrasonics Symposium, IUS 2025
PB - IEEE Computer Society
T2 - 2025 IEEE International Ultrasonics Symposium, IUS 2025
Y2 - 15 September 2025 through 18 September 2025
ER -