Tin whiskers: mitigation by the application of silica-loaded silicone conformal coating

Barrie Dunn

Research output: Contribution to conferencePosterpeer-review

Abstract

This poster summarises results of a recent study aimed to increase the reliability of miniature high density electronic assemblies for spacecraft application. It illustrates a means to mitigate against tin whiskers growths by the application of a silicone-based conformal coating containing a high loading of micron-sized silicon particles. The tested coating (MAPSIL 213 - SiO2) seems adequate when applied by brush to a thickness of >50 µm. Scratches, bubbles and edge thinning must be absent in order for this coating to be effective.
Original languageEnglish
Publication statusPublished - 6 Feb 2020
EventIPC-APEX Expo 2020 - San Diego, United States
Duration: 4 Feb 20206 Feb 2020

Conference

ConferenceIPC-APEX Expo 2020
Country/TerritoryUnited States
CitySan Diego
Period4/02/206/02/20

Keywords

  • electronics
  • Spacecraft materials
  • whisker growth
  • Mitigation potential
  • Coatings
  • tin
  • Failure mode

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