Tin whiskers: mitigation by the application of silica-loaded silicone conformal coating

Barrie Dunn

Tin whiskers: mitigation by the application of silica-loaded silicone conformal coating

Barrie Dunn

Research output: Contribution to conference › Poster › peer-review

Abstract

This poster summarises results of a recent study aimed to increase the reliability of miniature high density electronic assemblies for spacecraft application. It illustrates a means to mitigate against tin whiskers growths by the application of a silicone-based conformal coating containing a high loading of micron-sized silicon particles. The tested coating (MAPSIL 213 - SiO2) seems adequate when applied by brush to a thickness of >50 µm. Scratches, bubbles and edge thinning must be absent in order for this coating to be effective.

Original language	English
Publication status	Published - 6 Feb 2020
Event	IPC-APEX Expo 2020 - San Diego, United States Duration: 4 Feb 2020 → 6 Feb 2020

Conference

Conference	IPC-APEX Expo 2020
Country/Territory	United States
City	San Diego
Period	4/02/20 → 6/02/20

Keywords

electronics
Spacecraft materials
whisker growth
Mitigation potential
Coatings
tin
Failure mode

Access to Document

https://visitsandiego.com/event/february-1-2020-1200am/ipc-apex-expo-2020

2 Article

Materials in space: how materials science is pushing the boundaries in space engineering
Dunn, B., 1 Jun 2017, Materials World, 25, p. 29-33 5 p.
Research output: Contribution to specialist publication › Article

Open Access
An investigation of tin whisker growth over a 32-year period
Ashworth, M. A. & Dunn, B., 6 Dec 2016, (Early online) In: Circuit World. 42, 4, p. 183-196 14 p.
Research output: Contribution to journal › Article › peer-review

Open Access
File
255 Downloads (Pure)

Cite this

@conference{8bd8c1711cac4af7a169c0edd8173a4b,

title = "Tin whiskers: mitigation by the application of silica-loaded silicone conformal coating",

abstract = "This poster summarises results of a recent study aimed to increase the reliability of miniature high density electronic assemblies for spacecraft application. It illustrates a means to mitigate against tin whiskers growths by the application of a silicone-based conformal coating containing a high loading of micron-sized silicon particles. The tested coating (MAPSIL 213 - SiO2) seems adequate when applied by brush to a thickness of >50 µm. Scratches, bubbles and edge thinning must be absent in order for this coating to be effective. ",

keywords = "electronics, Spacecraft materials, whisker growth, Mitigation potential, Coatings, tin, Failure mode",

author = "Barrie Dunn",

year = "2020",

month = feb,

day = "6",

language = "English",

note = "IPC-APEX Expo 2020 ; Conference date: 04-02-2020 Through 06-02-2020",

}

TY - CONF

T1 - Tin whiskers

T2 - IPC-APEX Expo 2020

AU - Dunn, Barrie

PY - 2020/2/6

Y1 - 2020/2/6

N2 - This poster summarises results of a recent study aimed to increase the reliability of miniature high density electronic assemblies for spacecraft application. It illustrates a means to mitigate against tin whiskers growths by the application of a silicone-based conformal coating containing a high loading of micron-sized silicon particles. The tested coating (MAPSIL 213 - SiO2) seems adequate when applied by brush to a thickness of >50 µm. Scratches, bubbles and edge thinning must be absent in order for this coating to be effective.

AB - This poster summarises results of a recent study aimed to increase the reliability of miniature high density electronic assemblies for spacecraft application. It illustrates a means to mitigate against tin whiskers growths by the application of a silicone-based conformal coating containing a high loading of micron-sized silicon particles. The tested coating (MAPSIL 213 - SiO2) seems adequate when applied by brush to a thickness of >50 µm. Scratches, bubbles and edge thinning must be absent in order for this coating to be effective.

KW - electronics

KW - Spacecraft materials

KW - whisker growth

KW - Mitigation potential

KW - Coatings

KW - tin

KW - Failure mode

UR - http://ipcapexexpo2020.ipc.org

M3 - Poster

Y2 - 4 February 2020 through 6 February 2020

ER -

Tin whiskers: mitigation by the application of silica-loaded silicone conformal coating

Abstract

Conference

Keywords

Access to Document

Fingerprint

Research output

Materials in space: how materials science is pushing the boundaries in space engineering

An investigation of tin whisker growth over a 32-year period

Cite this