A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics
Research output: Contribution to journal › Article
Design/methodology/approach: The approach of this study reviews the microstructure and some other properties of tin-silver-copper series after the addition of indium, titanium, iron, zinc, zirconium, bismuth, nickel, antimony, gallium, aluminium, cerium, lanthanum, yttrium, erbium, praseodymium, neodymium, ytterbium, nanoparticles of nickel, cobalt, silicon carbide, aluminium oxide, zinc oxide, titanium dioxide, cerium oxide, zirconium oxide and titanium diboride, as well as carbon nanotubes, nickel-coated carbon nanotubes, single-walled carbon nanotubes and graphene-nano-sheets.
Findings: The current paper presents a comprehensive review of the tin-silver-copper solder series with possible solutions for improving their microstructure, melting point, mechanical properties and wettability through the addition of different elements/nanoparticles and other materials.
Originality/value: This paper summarises the useful findings of the tin-silver-copper series comprehensively. This information will assist in future work for the design and development of novel lead-free solder alloys.
|Journal||Soldering & Surface Mount Technology|
|Early online date||14 Oct 2019|
|Publication status||Early online - 14 Oct 2019|
- A review microstucture and properties of tin-silver-copper lead-free solder series for the applications of electronics AAM
Rights statement: Aamir, M., Muhammad, R., Tolouei-Rad, M., Giasin, K. and Silberschmidt, V. (2019), "A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics", Soldering & Surface Mount Technology, https://doi.org/10.1108/SSMT-11-2018-0046. Copyright © 2019, Emerald Publishing Limited. All rights reserved.
Accepted author manuscript (Post-print), 1.44 MB, PDF document